Campus Recruiting 2026 · Full-time & Internships

Help us redefine chip design with AI

10
Open roles
22
Openings

Why join

Work where AI and silicon meet

Frontier work

Sit at the intersection of large models and chip design, building RTL generation and AI-assisted verification from scratch.

Core projects

New graduates join core R&D directly; their work feeds directly into tape-out.

Fast ramp-up

One-on-one mentoring by senior engineers, working alongside industry experts. Six months to standing on your own.

Equity upside

Competitive salary and annual bonus; outstanding graduates join the core equity plan and share the long-term upside.

Two career tracks at once

Build depth in both chip design and large models — a combination the market is short of.

Team & workplace

River-view office in the West Bund AI Tower, Shanghai, right on Metro Line 11; teams in both Shanghai and Shenzhen.

Open roles

Class of 2026 openings

Built around our core strategy — AI defines the chip. Roles span large models (algorithms, training, applications) and chip design (front-end, verification, back-end, analog, process, FAE), covering the full path from algorithm to silicon.

Growth

From day one to owning your area

One-on-one mentoring

Every new graduate is paired with a senior engineer and a personalized growth plan, from onboarding to owning your own work.

Tech talks

Regular internal tech talks that keep you current on developments in both AI and silicon.

Real projects

Work on real chip projects across the full flow, from design through tape-out.

AI + silicon, together

Day-to-day work spans both the chip-design and the large-model side, so your skill set never narrows to just one of them.

Dual promotion tracks

Technical and management tracks side by side. Promotion follows capability, not seniority.

Compensation & benefits

So you can focus on the work that matters

Compensation

Competitive salary, annual bonus, and a core-member equity plan. Negotiable for outstanding candidates.

Statutory benefits

Full social insurance and housing fund based on actual salary, paid annual leave, and public holidays.

Health

Annual health check-up and related benefits.

Everyday perks

Free snacks and drinks, holiday gifts, and regular team events.

Workplace

River-view office in the West Bund AI Tower, Shanghai, right on Metro Line 11; Shenzhen office in Jinqi Zhigu Building, Nanshan.

Hiring process

From application to offer

1

Apply

Send your resume to our recruiting inbox with the subject line: Role-Name-University-Major-Class of 2026.

2

Resume screening

Reviewed jointly by HR and the engineering team. We reach out directly if there is a fit.

3

Technical interviews

With senior engineers and the engineering lead, focused on fundamentals and potential.

4

HR interview

Career plans, compensation expectations, and overall fit.

5

Offer

We extend an offer after the final interview and walk you through onboarding.

How to apply

We'd love to hear from you

Come help us redefine chip design with AI.

Email your resume to hr@xfunc.ai
Email subject format
Role-Name-University-Major-Class of 2026
Resume inbox
hr@xfunc.ai
What to send
Attach your resume as a PDF. Please also include project work, publications, competition results, GitHub links, or relevant coursework.
Office
East Tower, West Bund AI Tower, 701 Yunjin Road, Xuhui District, Shanghai · Room 807, Jinqi Zhigu Building, Tangling Road, Nanshan District, Shenzhen